ES-4029T Ultrasonic Heavy Wire Bonder in Russia EastBond

ES-4029T Ultrasonic Heavy Wire Bonder (for 100um to 500um aluminum wire) in Russia

ES-4029T Ultrasonic Heavy Wire Bonder
  • The most compact wire bonder in the world
  • For ultrasonic bonding of heavy aluminum wire (up to 500um / 20mil)
  • Vertical wire feed with programmable clamp force
  • Table tear wire termination
  • Suitable both for experimental lab & fab production
  • Automated Z & X axis high-speed motion
  • Changeable bonding heads to get all-in-one universal bonder
  • Suitable for bonding king-size items
  • 20 years lifecycle, 2 years warranty.

This manual heavy aluminium wire bonder with motorized Z & Y axis is able to perform a complete wire bonding sequence with bond termination by wire cutter & table tear.

Main features & benefits are described HERE.

Materials to download

Wire Bonders Brochure

Item pick-up point in Russia:

Wire type aluminium wire
diameter range: 100—500 μm = 3.9—19.7 mil
Wire feed & clamp vertical wire feed
unmovable clamp
Bond tool 2.5mm diameter x 26mm length wedge
(0.0984″ x 1″)
Ultrasonic system
  • built-in self-tuning ultrasonic generator
  • 60 kHz high-Q piezo-ceramic ultrasonic transducer
  • up to 50 watt output power
  • Bond time 15—1000 ms
    Bond force 50—500 grams, programmable
    1st and 2nd bond force can be separated
    Bond termination wire cutter (with programmable depth)
    table tear (tail and tear programmable)
    Performance up to 6000 bonds/hour
    Motorized Z & Y strokes Z stroke: 7 mm
    Y stroke: 7 mm
    Control type
  • manual & semi-automatic Z axis control by computer mouse
  • 8 programmable mouse buttons
  • right-handed and left-handed operation
  • mouse-aided interactive loop profile programming
  • electronic pedal (optional) as Z lever for hands-free operation
  • Manual XY movement XY travel: 85 x 85 mm
    Max. workpiece size: 300 x 300 x 55 mm
    Binocular optical system (standard) Magnification: 20x / 40x
    Focus distance: 93 mm
    Trinocular video optical system (optional) Optical magnification: 14x — 90x
    Microscope head focus distance: 100 mm
    Camera frame rate: 30fps
    Camera image delay: 50ms max
    Camera resolution: 1920×1080 (FullHD)
    Camera output interface: HDMI
    Monitor size: 7″
    Mouse-aided crosshair setup, distance measurement etc.
    Photo & video capture to SD card
    Simultaneous binocular & trinocular view
    Facility Electrical: 100—240V, 50 / 60 Hz
    Power consumption: 18—30 W
    Dimensions: 400 x 310 x 360 mm = 16 x 12 x 14 »
    Net weight: 16 kg = 35 lb
    • TPT HB30 (heavy wire bonder)
    • F&S Bondtec 5350 (heavy wire bonder)
    • high-power & high-current devices;
    • optoelectronic modules;
    • hybrids/MCMs;
    • microwave products;
    • discrete devices/lasers;
    • chip-on-boards;
    • leads;
    • sensors.
    • automotive unit repairing (EFI, ABS etc.)
    • education
    • prototyping
    • repair
    • small scale production
    • pre-series
    • series (low-loop-count devices)

    Other equipment


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